Mini-ITX
TOP800B
Four display paths, Core Ultra at 28 W and M.2 B/E. A base for signage and kiosk projects. The display edge is already dense.
Capability / OEM and ODM
Change the board, not the platform.
BIOS and boot logo, I/O pinout and protection, heatsink and enclosure, packaging and silkscreen. A sample before production.
- BIOS
- Logo
- I/O
- Mech
- Pack
Manufacturing is by Piesia. Customization scope and sample terms are confirmed per project; MOQ and lead time are open items, not published commitments.
The change surface / five layers
From a boot logo to a new enclosure.
The further a change moves from software, the more tooling it touches. The first review is always the change list.
- BIOS and boot logo Software build. No tooling.
- I/O pinout and protection Schematic review. New connector tooling if the pinout changes.
- Heatsink and enclosure Thermal review. New tooling if the envelope changes.
- Packaging and silkscreen Artwork proof. Print plates for the packaging run.
Sample to production / six steps
A sample is a checkpoint, not a promise.
The sequence is fixed; the duration is scoped per project. No step is skipped for a repeat order. Deliverables are a sample record, change list and released configuration, confirmed per project.
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01
Requirement
Model, enclosure, change list and target date.
-
02
Engineering review
Thermal, connector and DFM check before a sample is built.
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03
Sample
First article with the agreed changes.
-
04
Validation
Fit, function and document check against the request.
-
05
Pilot
A small run to confirm the process.
-
06
Production
Repeat runs against the released configuration.
Change matrix / routine or tooling
What is routine, what needs tooling.
| Change | Class | Review or tooling | MOQ impact |
|---|---|---|---|
| BIOS and boot logo | Software | Build and release check | Open |
| I/O pinout and protection | Review | Schematic and EMC review | Open |
| Heatsink and enclosure | Tooling | Thermal review and new tooling | Tooling-dependent |
| Packaging and silkscreen | Print setup | Artwork proof and print plates | Open |
| Any change request | Open | Scope confirmed at quotation | Confirmed with your quote |
The class sets the review path, not the price. A tooling change moves the sample date; a BIOS change does not. MOQ is confirmed at quotation.
Customization bases / three models
Three useful starting points.
Each base leaves a different part of the envelope open.
Piesia scale / supplier evidence
The line behind the sample.
8,000 m²
Production base.
~30,000
Units per month.
40+
R&D staff.
5–10 years
Industrial lifecycle norm.
7–15 years
Intel embedded availability.
Scale from supplier documentation. Lifecycle and availability are industry norms, not a model-specific commitment. The numbers describe the partner's line, not a project schedule.
Before the sample
Three project questions, answered.
What is the MOQ?
MOQ is confirmed per project. It depends on the change class and the tooling; it is not a published number. Tooling-dependent changes usually move it.
Who owns the customization?
Customization scope, tooling ownership and exclusivity are confirmed in the quotation. The board design base remains the Piesia platform.
How long does a sample take?
Sample timing is confirmed after the engineering review. No fixed turnaround is published until the scope is agreed. A software-only change is shorter than a new enclosure.
OEM and ODM / scoped inquiry
Send the change list and the target date.
Model, enclosure and changes. Include the intended enclosure. Quote within 24–48 h; open terms confirmed at quotation.
Customization scope and sample terms are confirmed per project; MOQ and lead time are open items.
Illustrative scene
